WB300 - Solder Ball Placement Machine
WB300 - Solder Ball Placement Machine

WB300 - Solder Ball Placement Machine

Normaler Preis
€0,00
Sonderpreis
€0,00
Normaler Preis
Ausverkauft
Einzelpreis
pro 
inkl. MwSt. zzgl. Versandkosten

Part number 1503300 (machine for ball diameters ≥ 250 µm)
Part number 1701000 (machine for ball diameters ≥ 100 µm)
Part number 1506364 (desk, height-adjustable)
Part number 1506377 (footswitch)

▷ Products: wafer, substrate / panel, BGA, CSP, etc.
▷ Product size: ≤ 300x300 mm / 12x12 inch
▷ Ball diameter: ≥ 100 µm (smaller diameters on request)
▷ Throughput time: ≥ 20 products / hour
▷ Tooling set-up time: ≤ 30 min.

Custom, product-specific vacuum plates and ball placement stencils available on request.